03. December 2019 | Press Releases

Sumitomo Electric launches 150mm GaN-on-SiC production with AIXTRON Planetary® system

AIX G5+ supports capacity ramp-up for RF device manufacturing

Herzogenrath/Germany, December 03, 2019 – AIXTRON SE (FSE: AIXA), a worldwide leading provider of deposition equipment to the semiconductor industry, announced today that Japanese group Sumitomo Electric Device Innovations, Inc. (SEDI) has ordered an AIX G5+ tool with 8x6-inch wafer configuration in order to expand the production capacity of GaN-on-SiC (gallium nitride-on-silicon carbide) radio frequency (RF) devices for wireless applications such as radars, satellite communication and base stations for the rapidly expanding 5G mobile networks. The system is scheduled for delivery in 2019.

SEDI has already been successfully relying on AIXTRON’s Showerhead technology for the production of 4-inch GaN epitaxial wafers. The progressive deployment of 5G networks but also the introduction of new technologies like beamforming is foreseen to drive a rapid upturn in demand steering the adoption of more efficient 6-inch substrates for RF applications on AIXTRON’s proven Planetary® systems.

By selecting the AIX G5+ Planetary® MOCVD platform, SEDI relies on the tool-of-record for GaN-based high electron mobility transistors (HEMTs) warranting not only superior process yields but also enabling lowest cost of ownership of the market. The system has an unmatched reputation for wafer uniformity and precise process control, which is especially important for device production on cost-intensive silicon carbide wafers. The new reactor is equipped with an EpiCurve TT metrology system as well as with Auto-Feed Forward and P400 UV Pyrometer Close Loop temperature control.

Sumitomo Electric Device Innovations, Inc. has an established industry reputation based on its portfolio of state-of-the-art RF components. The company already has a range of GaN HEMT (High Electron Mobility Transistor) devices on offer for radar, mobile phone base-stations, and general applications. These GaN-on-SiC HEMT devices enable high power amplification at operating frequencies of 28-40 GHz and beyond as required by new 5G communication standards.

Download press release

Our registered trademarks: AIXACT®, AIXTRON®, Atomic Level Solutions®, Close Coupled Showerhead®, CRIUS®, EXP®, EPISON®, Gas Foil Rotation®, Optacap™, OVPD®, Planetary Reactor®, PVPD®, STExS®, Trijet®

Your contact person

Christian Ludwig

Vice President Investor Relations & Corporate Communications

Phone: +49 (2407) 9030-444

Send e-mail
Xing
LinkedIn

Service

AIXTRON SE (Headquarters)

AIXTRON 24/7 Technical Support Line

AIXTRON Europe

AIXTRON Ltd (UK)

AIXTRON K.K. (Japan)

AIXTRON Korea Co., Ltd.

AIXTRON Taiwan Co., Ltd. (Main Office)

AIXTRON Inc. (USA)

Products

Vincent Meric
Vice President Marketing

Career

Laura Preinich
Recruiter

Tom Lankes
Talent Acquisition Expert- Ausbildungsleitung

Sustainability

Christoph Pütz
Senior Manager ESG & Sustainability

Investor Relations

Christian Ludwig
Vice President Investor Relations & Corporate Communications

Ralf Penner
Senior IR Manager

Press & Public Relations

Christian Ludwig
Vice President Investor Relations & Corporate Communications

Research & Development

Prof. Dr. Michael Heuken
Vice President Advanced Technologies