19. April 2012 | Press releases
AIXTRON SE today announced that MicroLink Devices, located in Niles, IL, USA, has further increased its capacity for manufacturing HBT and solar cell epitaxial structures by ordering a second AIXTRON 2800G4 MOCVD reactor with automated wafer loading. The order was received in the third quarter of 2011 and will be delivered within the second quarter of 2012.
Dr. Noren Pan, President of MicroLink Devices, states, “The material quality and uniformity from our first AIX 2800G4 shows great promise. Due to the economic advantages of this MOCVD reactor, AIXTRON provides the best cost model for high-volume epitaxial wafer manufacturing. Our customers will benefit from this high throughput reactor by experiencing a reduction in their qualification costs.”
AIXTRON COO Dr. Bernd Schulte comments: “The development of this larger capacity automated MOCVD system provides benefits in all areas of a production cost model such as throughput, cycle time, and yield. We are pleased that MicroLink Devices has recognized these advantages evident by this purchase of a second reactor.”
Dr. Pan founded MicroLink Devices in 2000. The epitaxial wafers produced by the company are an essential component in high-speed communication and solar cell devices. The company has earned the ISO 9001 Certification since 2005 for its quality and service practices, and has been a prime federal contractor (NASA, DARPA, Air Force Research Labs, Naval Research Labs, Special Operations and Command, Department of Energy, National Renewable Energy Labs, and National Science Foundation) on many solar cell, and electronics projects over the past six years. MicroLink Devices has collaborated on commercial research and development projects with many other companies. The results of these projects have been exploited in widely-used commercial products.
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