03. July 2012 | Silicon Semiconductors

AIXTRON Ships Next Generation QXP-8300 Atomic Layer Deposition Systems to Major Korean Customer

AIXTRON SE, a major supplier of semiconductor deposition equipment and services, announced that it has received a multi-tool order for its next generation QXP-8300 ALD system from a leading Korean DRAM manufacturer. The QXP-8300 production system for sub-30 nm DRAM technology nodes will help accelerate high-volume manufacturing of the most advanced DRAM technology node available.

“The AIXTRON QXP-8300 was chosen over other competitive ALD products based on its superior film quality, excellent defect control and best-in-class productivity,” says Dr. Sasangan Ramanathan, Chief Technical Officer at AIXTRON Inc. “This order is a clear indicator of our customers’ confidence in AIXTRON’s technology leadership and superior product performance,” he also adds.

Dr. Bernd Schulte, Executive Vice President and Chief Operating Officer at AIXTRON, comments: “We are very pleased that the leading Korean memory manufacturer has decided to select the QXP-8300 for their advanced DRAM chip manufacturing, and we look forward to supporting their ramp-up in production.”

Our registered trademarks: AIXACT®, AIXTRON®, Atomic Level Solutions®, Close Coupled Showerhead®, CRIUS®, EXP®, EPISON®, Gas Foil Rotation®, Optacap™, OVPD®, Planetary Reactor®, PVPD®, STExS®, Trijet®

Your contact person

Christian Ludwig

Vice President Investor Relations & Corporate Communications

Phone: +49 (2407) 9030-444

Send e-mail
Xing
LinkedIn

Service

AIXTRON SE (Headquarters)

AIXTRON 24/7 Technical Support Line

AIXTRON Europe

AIXTRON Ltd (UK)

AIXTRON K.K. (Japan)

AIXTRON Korea Co., Ltd.

AIXTRON Taiwan Co., Ltd. (Main Office)

AIXTRON Inc. (USA)

Products

Vincent Meric
Vice President Marketing

Career

Laura Preinich
Recruiter

Tom Lankes
Talent Acquisition Expert- Ausbildungsleitung

Sustainability

Christoph Pütz
Senior Manager ESG & Sustainability

Investor Relations

Christian Ludwig
Vice President Investor Relations & Corporate Communications

Ralf Penner
Senior IR Manager

Press & Public Relations

Christian Ludwig
Vice President Investor Relations & Corporate Communications

Research & Development

Prof. Dr. Michael Heuken
Vice President Advanced Technologies