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09. September 2015 | Press releases
First order for recently acquired innovative technology
AIXTRON SE (FSE: AIXA; NASDAQ: AIXG), a worldwide leading provider of deposition equipment to the semiconductor industry, has sold the first Optacap-200 encapsulation tool to a major Asian display manufacturer. The standalone R&D system that handles substrate sizes of 200 mm x 200 mm was ordered in the third quarter 2015 and is scheduled for delivery in the first quarter 2016.
The innovative Optacap plasma enhanced chemical vapor deposition (PECVD) technology enables the deposition of highly flexible and effective barrier films for thin-film encapsulation of OLED display, OLED lighting, organic photovoltaic and flexible electronic devices.
“Thin-film encapsulation is an essential step within the OLED manufacturing process. Therefore, we are delighted to be able to provide an innovative solution to the industry which delivers excellent barrier films at high throughput. Therefore, this solution contributes to a significant reduction of manufacturing costs for the critical encapsulation process step within the production of flexible as well as rigid OLED devices”, says Andreas Toennis, Chief Technology Officer of AIXTRON SE.
The groundbreaking Optacap encapsulation technology has been the main driver for AIXTRONs acquisition of Silicon Valley-based Company PlasmaSi, Inc.in April 2015. The full integration of the technology into AIXTRONs already existing OLED activities is part of the company’s incorporation into the AIXTRON Group.
Our registered trademarks: AIXACT®, AIXTRON®, Atomic Level Solutions®, Close Coupled Showerhead®, CRIUS®, EXP®, EPISON®, Gas Foil Rotation®, Optacap™, OVPD®, Planetary Reactor®, PVPD®, STExS®, Trijet®
Christian Ludwig
Vice President Investor Relations & Corporate Communications
Alan Tai
Taiwan/Singapore
Christof Sommerhalter
USA
Christian Geng
Europe
Hisatoshi Hagiwara
Japan
Nam Kyu Lee
South Korea
Wei (William) Song
China
AIXTRON SE (Headquarters)
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Laura Preinich
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Tom Lankes
Talent Acquisition Expert- Ausbildungsleitung
Christoph Pütz
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Christian Ludwig
Vice President Investor Relations & Corporate Communications
Ralf Penner
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Christian Ludwig
Vice President Investor Relations & Corporate Communications
Prof. Dr. Michael Heuken
Vice President Advanced Technologies